Sommer Precision Technology 
   
  

Diamond grinding and polishing discs

WEGA

WEGA flat grinding disc The new WEGA flat grinding disc is an economic alternative to sandpaper. The advantages of this disc - its high rate of abrasion and long service life - are best displayed chiefly when applied on hard to very hard working materials (irrespective of whether embedded or not embedded). The cut sections receive optimal sharpness at the edges by means of the short polishing times. WEGA is suited both to the manual and to the automatic preparation of samples.

WEGA flat grinding discs may be obtained either with a self-adhesive reverse side or with a metallic holder (for magnetic systems).

Available diameters200mm, 250mm, 300mm
Grain-sizesD46, D76, D126

ROCKET

ROCKET is a novel type of self-adhesive grinding and polishing disc. The diamonds are bonded in a 1 mm layer of synthetic resin.

The ROCKET's popularity amongst users is due to its high abrasive performance and its long service life. Your cut sections achieve an optimal smoothness at the edges after only short periods of polishing. This disc can be considered as an alternative to lapping discs. In handling hard materials you may when using a D15 disc under certain circumstances dispense with all grinding steps with SiC sandpaper and subsequently immediately select the 3-micron polishing level.

Our product “BLAU” or water or any other commonly-used medium may be used as a lubricant. When subject to heavy use, the discs should be re-ground from time-to-time using a grinding-stone. ROCKET can also be obtained either with a self-adhesive reverse-surface or on a metal carrier (for magnetic systems).

Available diameters200mm, 250mm und 300mm
Grain-sizes(1µ), 3µ, (6µ), D15, (D30)

Other dimensions and grain sizes are obtainable upon request.

Demotec - diamond grinding and polishing discs

Demotec - diamond grinding and polishing discs These self-adhesive discs have for many years now proved their value in the area of material evaluation. From surface grinding right through to fine grinding, these discs offer the user a carefully calibrated intensity of the diamond grain. On the larger grain sizes (250µ to 40µ) the diamond grains have a nickel bonding and on the finer grain sizes (30µ to 10µ) an synthetic resin bonding with a studded structure is used.

The following discs are deliverable from our warehouse or in any event may be delivered at short notice:

Available diameters200mm, 230mm, 250mm, 300mm
Grain-sizes10µ (K), 30µ (K), 40µ (N), 75µ (N), 125µ (N), 250µ (N)
K = synthetic resin bonding
N = nickel bonding

Updated: 30. Januar 2005
© Sommer Präzisionstechnik